To solve the existing problems of high pole lighting attenuation, it is recommended that street light manufacturers start from the basic materials and solve the problem of high power LED heat sources from the inside out. For example, when bonding light-emitting components to aluminum substrates, thermally conductive adhesives play a key role. Some manufacturers think that the thermal conductivity of thermally conductive films or thermal pads is better, and the thicker the film, the better, but they do not think about thermal resistance. No matter how good the thermal conductivity is, the thermal resistance to the film thickness is useless. What's more, the thermally conductive adhesive film or soft thermally conductive pad cannot really adhere to the substrate, and there are actually many pores on the bonding surface. These pores, viewed under an electron microscope, are like hollow cavities, which is another form of thermal resistance. In the presence of so many thermal resistances that interfere with heat conduction, the efficiency of heat dissipation is virtually reduced.

Use thermal conductive adhesive, recommended soft ceramic thermal conductive adhesive. The soft ceramic thermal conductive adhesive for screen printing construction is different from the traditional laminating thermal conductive adhesive film. The soft ceramic thermal conductive adhesive is a soft semi-liquid. When the screen printer blade is coated on an aluminum substrate, the thermal conductive particles will penetrate into the pores on the surface of the substrate and I fill to full. In this way, a completely flat surface with no pores will be formed, which will be completely tightly bonded to the LED epitaxial substrate. In this way, the thermal resistance is reduced to a minimum, and the heat can be quickly conducted out, naturally reducing the ambient temperature of the LED die, extending the life of the epitaxial and significantly delaying the occurrence of light decay. In addition, due to the ductility of the soft ceramic heat-conducting paint for screen printing, it will change with the thermal expansion and contraction of the aluminum substrate during high-temperature baking or reflow. The stress is very small, and it will not cause the aluminum substrate to warp, let alone Will burst.